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9-1 High Power Cool White LED - 3W ( emitter packing )( 5000K - 7000K ) - Chingtek.net
9-2 High Power RYGB LED - 3W ( emitter packing )( 440nm - 650nm ) - Chingtek.net
9-3 High Power Infrared LED - 3W ( emitter packing )( 660nm - 940nm ) - Chingtek.net


High Power Cool White LED - 3W ( emitter packing )

5000K - 7000K

High power Cool White LED chips 3W by emitter packing - 5000k 6300k 7000k - Chingtek.net


         Key Features         


  1. 3W High Power Emitter LED.

  2. Half Angle (2θ1/2) : 140°

  3. Lens Color : Silicone Water Clear.

  4. Silicone compression molding lens.



         Applications          


  1. General Lighting

  2. Decorative Lighting

  3. Architectural Lighting

  4. Street Lamps



         Package Dimensions (mm) :         


High power Cool White LED chips 3W by emitter packing - 5000k 6300k 7000k - Chingtek.net
Notes :
1. All dimensions are in millimeters
2. Tolerance is ±0.25mm


         Electrical/Optical Characteristics (Ta=25°C)         


Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Luminous Flux
ΦV
IF=350mA
48
160
lm
Color Temperature
CCT
IF=350mA
5000
10000
K
Forward Voltage
VF
IF=350mA
2.8
3.8

V
Thermal Resistance
JunctionTo Board
RthJ-B
IF=350mA
13
°C/W
Temperature
Coefficient of
Forward Voltage
ΔVF/ΔT
IF=350mA
2
mV/°C
Reverse Current
IR
VR=5V
10
μA
Viewing Angle Note[1]
2θ1/2
IF=350mA
130
140
150
Degree
Color Render Index (CRI)
Ra
IF=350mA
60


         Absolute Maximum Rating (Ta=25°C)         

Parameter
Symbol
Conditions
Units
Power Dissipation
PD
3
W
Continuous Forward Current
IF
700
mA
Peak Forward Current Note[2]
IF(Peak)
1000
mA
LED Junction Temperature
Tj
120
/°C
Reverse Voltage
VR
5
V
Operating Temperature Range
Topr
30°C To +80°C
Storage Temperature Range
Tstg
-40°C To +100°C
Manual Soldering Temperature
Tsol
260°C±20°C For 3-5 Seconds
ESD Sensitivity
ESD
2000V HBM
Note:
[1] Tolerance θ:10° .
[2] 1/10 Duty Cycle 0.1ms Pulse Width.




         BIN Structure         


High power Cool White LED chips 3W by emitter packing - 5000k 6300k 7000k - Chingtek.net
High power Cool White LED chips 3W by emitter packing - 5000k 6300k 7000k - Chingtek.net


         Spectrum Distribution         

High power Cool White LED chips 3W by emitter packing - 5000k 6300k 7000k - Chingtek.net


         Characteristic Curves         

High power Cool White LED chips 3W by emitter packing - 5000k 6300k 7000k - Chingtek.net


         Typical Radiation Pattern         

High power Cool White LED chips 3W by emitter packing - 5000k 6300k 7000k - Chingtek.net
High power Cool White LED chips 3W by emitter packing - 5000k 6300k 7000k - Chingtek.net


         Typical Reflow Soldering Profile         

High power Cool White LED chips 3W by emitter packing - 5000k 6300k 7000k - Chingtek.net
Profile Feature
Typical parameters
Average Ramp-Up Rate (Ts max to Tp)
3 °C/second max.
Preheat Temperature Min (Ts min )
150 °C
Preheat Temperature Max (Ts max )
200 °C
Time (ts min to ts max )
60-180 seconds
Time maintained above Temperature (TL)
217 °C
Time maintained above Time (tL)
60-150 seconds
Peak/Classification Temperature (Tp)
260 °C
Time within 5 °C of Actual Peak Temperature (tp)
5 seconds
Ramp-Down Rate
6 °C/second max.
Time 25 °C to Peak Temperature
8 minutes max.


         Tube Packing         

High power Cool White LED chips 3W by emitter packing - 5000k 6300k 7000k - Chingtek.net
Unit : mm
W1
W2
H1
H2
L

16.5
9.6
8.0
3.4
424.0
±0.2
±0.2
±0.2
±0.2
±2.0


         Tape-and-Reel Packing         


- Reel dimensions - High power Cool White LED chips 3W by emitter packing - 5000k 6300k 7000k - Chingtek.net
Unit : mm
M
N
W
W1
H
K
S

Φ330.0
Φ99.5
24.4
29.0
Φ13.5
10.75
2.5
±1.0
±1.0
±1.0
±1.0
±0.5
±0.5
±0.5


- Carrier tape dimensions - High power Cool White LED chips 3W by emitter packing - 5000k 6300k 7000k - Chingtek.net
Unit : mm
W
P
E
F
P2
D
D1
P0
A0
B0
K0
T

24.0
12.0
1.75
11.5
2.0
1.5
1.5
4.0
8.45
15.0
5.10
0.37
±0.3
±0.1
±0.1
±0.1
±0.1
±0.1
±0.25
±0.1
±0.1
±0.1
±0.1
±0.02


         Used Notice         



  1. In order to avoid absorption of moisture, it is recommended that the products are sotred in the dry box (or desiccators) with a desiccants. Alternatively the following environment is recommended. Storage temperature: 5°C ~ 30°C , Humidity: 60% HR Max.

  2. If the storage conditions are of high humidity the product should be dried before use. Recommended drying conditions: 12 hours at 100°C±5°C

  3. Any mechanical force or any excess vibration should be avoid during the cooling process after soldering.

  4. Reflow rapidly cooling should be avoided.

  5. Components should not be mounted on distorted Printed Circuit Boards.

  6. Devices should not contact with any types of fluid, such as water , oil , organic solvents…. etc.

  7. The maximum ambient temperature should be taken into consideration when determining the operating current.

  8. Devices should be soldered within 7 days after opening the moisture-proof packing.

  9. Repack unused product in anti-moisture packing, fold to close any opening and store in a dry place.

  10. The appearance and specifications of devices may be modified for improvement without notice.

  11. ESD Precautions Static Electricity and surge damages LEDs. It is recommended that wrist bands or anti-electrostatic gloves be used when handing the LEDs . All devices, equipment and machinery should be properly grounded.

  12. This product must be driven by constant power supplier.




         Ordering Information         


Color
Order Code
Luminous Flux (lm)
Min
Max
Cool White
LED-003-w06K
110
120
LED-001-w12K
100
110

      

  P.S.  

  1. Caution !! Do not look directly at the UV light , and please wear safety Goggles.


UV_danger - Chingtek.net

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